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New Temporary Bonding Solution for 2.5D and 3D IC Packaging presented at ECTC 2013
Dow Corning to sponsor the AWA industry seminar in 2013; offer keynote presentation
Dow Corning To Showcase Silicone Solutions for Pharmaceutical and Biopharmaceutical Processing at BPI 2013
Dow Corning Reports Sales and Profits
for First Half of 2013
Dow Corning Takes Prestigious 3D InCites Award for Its Advanced New Temporary Bonding Solution for 2.5D and 3D IC Innovation
Collaboration in Materials and Processing Technology as Critical to the Semiconductor Industry's Recovery
Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging
Dow Corning Recognized with Two Prestigious Awards from LIGHTFAIR International
Dow Corning Expands Thermal Management Options with Two Products Offering Optimized Rheology
Dow Corning Sponsors Tall Building Conference in London
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