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Product Q&A Short Description	Industry	application
How do silicones protect?	Electronics
Lumps in Material After Cure	Electronics
Inhibition from Latex Gloves	Electronics
Adhesion Problems on Cast Aluminum	Electronics
Adhesion to Plastic Substrates	Electronics
Improving Adhesion to Plastic	Electronics
Adhesion to Plastics	Electronics
Electrical Opens for Components	Electronics
Swelling of Silicones in Solvent	Electronics
Effects of Low Temperature on Cured Silicone	Electronics
Curing Over Solder Fluxes	Electronics
Water Absorption Values	Electronics
One-part Methoxy Cure Mechanism	Electronics
Acceleration of Methoxy Cure Materials	Electronics
Methoxy Cure Times	Electronics
Compatibility of Methoxy & Platinum Cure Materials	Electronics
Outgassing from Methoxy Cure	Electronics
Two-part Alkoxy Cure Mechanism	Electronics
Reversion of Alkoxy Cure Materials	Electronics
Compatibility of Alkoxy and Platinum Cure	Electronics
Platinum Cure Mechanism	Electronics
Checking for Inhibition	Electronics
Adhesion Problems with Heat Cure Materials	Electronics
Storing at Low Temperatures Before Use	Electronics
Inhibition in Gels	Electronics
Swelling of Silicones in Solvents	Electronics
Will poorly cured material improve?	Electronics
Humidity and time needed for one part cure	Electronics
Heat acceleration of one part cure	Electronics
Continued cure at RT addition cure	Electronics
Continued cure at RT moisture cure	Electronics
What are silicone gels	Electronics
Applying primer by hand	Electronics
Cloudy and white looking primer	Electronics
Primer thickness	Electronics
Relation between Shore A and OO	Electronics
Common causes of inhibition	Electronics
Getting rid of inhibition	Electronics
Tips for deairing	Electronics
What is inhibition?	Electronics
RTV definition	Electronics
Thermoset definition	Electronics
Encapsulant vs potting	Electronics
Problems When Starting Up Process	Electronics
Only Certain Parts Cure in Oven	Electronics
How long does heat curing take?	Electronics
Effect of thermal mass on cure time	Electronics
Material contamination and cure time	Electronics
Excess flux residues	Electronics
Material cured in container	Electronics
Storage or shipping conditions were warm	Electronics
Solder fluxes and adhesion	Electronics
Adhesion problems	Electronics
Time to gain adhesion	Electronics
Wetting and adhesion	Electronics
Effect of thermal mass on achieving adhesion	Electronics
Potential effect of solvents on adhesion	Electronics
Potential effect of low temperature on adhesion	Electronics
Potential effect of high temperature on adhesion	Electronics
Adhesion and substrate compatibility	Electronics
Poor wetting of substrates	Electronics
Debris on parts and electrical failures	Electronics
Debris in coating and electrical failures	Electronics
Adhesion and electrical problems	Electronics
Coating underside of leads on components	Electronics
Flux residues and electrical problems	Electronics
Replenish dip tanks with fresh material	Electronics
Thin coating and electrical failures	Electronics



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