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Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process
Industry News 2009.07.08
Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow...
Krayden, Inc. Awarded
Industry News 2009.01.27
Dow Corning Electronics Awards Krayden, Inc. North America 2008 Distributor of the Year
DOW CORNING TC-2030 Thermally Conductive Adhesive
Industry News 2008.12.12
Dow Corning Electronics Introduces New High-Performance DOW CORNING TC-2030 Thermally Conductive...
Electronics Introduces New Optical Encapsulant Gel
Industry News 2008.11.03
Dow Corning Electronics Introduces New Optical Encapsulant Gel (OE-6450)
Electronics' SE 1720 Adhesive Offers Fast Curing at Lower Temperatures
News 2008.10.06
Electronics' SE 1720 Adhesive Offers Fast Curing at Lower Temperatures (Dow Corning's SE 1720 CV)
Electronics' Introduces its High-Performance TC-5026 Thermal Grease to the Automotive Industry
News 2008.09.30
Electronics' Introduces its High-Performance TC-5026 Thermal Grease to the Automotive Industry
Electronics Solutions Develops High-Performance Thermally Conductive Compound For Intel’s New Mobile Processor Platforms
Industry News 2008.08.19
Dow Corning Electronics Develops High-Performance Thermally Conductive Compound For Intel’s...
Dow Corning Corporation Receives Intel’s Preferred Quality Supplier Award
Industry News 2008.03.17
Dow Corning Corporation Receives Intel’s Preferred Quality Supplier Award
U.S. Computer Manufacturer to Use Electronics’ TC-5121 Thermally Conductive Compound at Facility in China
Industry News 2008.03.11
U.S. Computer Manufacturer to Use Dow Corning Electronics’ TC-5121 Thermally Conductive Compound...
Dow Corning Electronics Supports Growing Market Demand By Expanding Polymer Production For Silicon-Infused Bilayer Photoresist
Industry News 2008.02.19
Dow Corning Electronics Supports Growing Market Demand By Expanding Polymer Production For...
Jeroen Bloemhard, Global Executive Director, Electronics and Advanced Technologies featured in Semiconductor International "Executive Outlook" January 2008 issue
Corporate News 2008.01.10
Jeroen Bloemhard, Global Executive Director, Electronics and Advanced Technologies featured...
Electronics Solutions’ New Thermally Conductive Compound Offers Electronics Makers Affordable, Effective Conductivity
Industry News 2007.12.11
Dow Corning Electronics’ New Thermally Conductive Compound Offers Electronics Makers Affordable,...
New Silicon-Infused Bilayer Photoresist Developed By TOK and Dow Corning Electronics Being Used In IC Memory Production
Industry News 2007.12.03
New Silicon-Infused Bilayer Photoresist Developed By TOK and Dow Corning Electronics Being...
SMT’s October E-newsletter Highlights Contributed article from Electronics' Protection Market
Industry News 2007.10.18
SMT’s October E-newsletter Highlights Contributed article from Dow Corning’s Electronics...
Electronics Solutions Introduces Three New Encapsulants For The Fast-Growing Light-Emitting Diode Market
Industry News 2007.10.16
Dow Corning Electronics Introduces Three New Encapsulants For The Fast-Growing Light-Emitting...
Electronics’ Silicon Lithography Solutions Article Makes Editor’s Pick!
Industry News 2007.10.02
Dow Corning Electronics’ Silicon Lithography Solutions Article Makes Editor’s Pick!
Compound Semiconductor Solutions Wins Additional U.S. Navy Funds for Semiconductor Silicon Carbide Development
Industry News 2007.09.04
Dow Corning Compound Semiconductor Solutions Wins Additional U.S. Navy Funds for Semiconductor...
Midland Daily News Interviews Dow Corning Electronics' Ken Seibert
Industry News 2007.08.30
Dow Corning receives patent to make better microchip insulator
Dow Corning Electronics Appoints ATVB Leaders to Address Market Opportunities and Growth in Asia
Industry News 2007.07.16
Dow Corning Electronics Appoints ATVB Leaders to Address Market Opportunities and Growth in Asia
Dow Corning Electronics Improves Flip-Chip Adhesive Process Speed, Temperature Performance
Industry News 2007.07.03
Dow Corning Electronics Improves Flip-Chip Adhesive Process Speed, Temperature Performance
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