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Find a Distributor
To find a distributor, you must first locate a product.

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Your search: Electronics  IC Packaging > Die Encapsulant  Encapsulants 
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DOW CORNING® JCR 6110 A/B
Two-part, low modulus LED gel encapsulant with high transparency and long working time.
Distributors
DOW CORNING® JCR 6224
One-part, black, heat cure, thixotropic, DRAM grade.
Distributors
HIPEC® Q1-4939 SEMICONDUCTOR PROTECTIVE COATING & CURING AGENT
2-part clear heat cure, cures to elastomer or gel depending on mix ratio, good flowability
Distributors
HIPEC® Q1-9239 SEMICONDUCTOR PROTECTIVE COATING
One-part, black, heat cure, controlled thixotropy-flowable as dispensed, self-priming adhesion.
Distributors
HIPEC® Q3-6646 SEMICONDUCTOR PROTECTIVE COATING KIT
Two-part, transparent, low modulus LED gel encapsulant with high transparency, low viscosity, and very long working time.
Distributors
HIPEC® R 6101 SEMICONDUCTOR PROTECTIVE COATING
One-part, clear, heat cure, good flowability, soft elastomer, self-priming adhesion.
Distributors
HIPEC® R 6102 SEMICONDUCTOR PROTECTIVE COATING
One-part, black, heat cure, good flowability, soft elastomer, self-priming adhesion.
Distributors
SYLGARD® 170 FAST CURE SILICONE ELASTOMER KIT
Two-part, black, 1:1, fast RT curing, low viscosity, general purpose, UL.
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