Power Electronics Solutions
Laser Mark Format
Dow Corning employs laser mark methodology similar to that identified
by Semiconductor Equipment and Materials Institute (SEMI®) guidelines.
with the flat down.
Height 1.624 +
Spacing 1.420 + 0.025 mm
Character String: 100 mm wafers
Character String: 150 mm wafers
For more information about our laser mark format, contact us.