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Compound semiconductor
solutions for advanced
power electronics


IMAGINE: Leading the Advance in Power Electronics

As global society seeks applications that offer higher-efficiency energy utilization, corporations worldwide are increasing investment in cost-effective, high-performance power electronic devices.  For decades, energy, transportation and industrial systems have run on conventional silicon-based power diodes and transistors. Yet, steadily increasing demands for higher power densities are pushing silicon-based semiconductor devices to their physical limits. The solution is next-generation wide-bandgap semiconductor materials, such as silicon carbide (SiC), that are suited to efficiently handle the electrical loads, switching rates and other performance capabilities required to reduce energy losses and lower overall system costs.

As a leading global provider of high-quality compound semiconductors for power electronics applications, Dow Corning is helping to drive this revolution forward. Our SiC semiconductor portfolio offers 4H n+ conducting SiC wafers as well as SiC epitaxial layers (n- or p-doped).

Our n-conducting 100- and 150-mm diameter SiC substrates and epitaxy services offer the industry-leading technology needed to develop more efficient and compact power electronics targeting the following sectors.

  • Industrial: Dow Corning’s high-quality SiC wafers offer a solid foundation to develop a new generation of industrial motor controls and power supplies that use electricity and space more effectively and operate more efficiently.
  • Transportation: From rail to road to aerospace, Dow Corning’s SiC solutions can help device manufacturers and systems producers reduce the size and weight of power modules while potentially increasing a vehicle’s acceleration, range and/or speed.
  • Energy: SiC substrates and epitaxy from Dow Corning can help you increase the efficiency and performance of your solar inverter and wind turbine designs, and also provide the fundamental building blocks for the emerging smart grid. Our SiC solutions may further reduce system costs through better thermal management, smaller form factors and simplified system designs.

Dow Corning also offers more than 70 years of proven expertise innovating advanced silicone encapsulants, sealants, potting agents and coatings for its power electronics design partners. We work closely with customers to develop the advanced packaging solutions that will improve the cost efficiency, durability and performance of their most advanced power electronic components.

A proactive and collaborative innovator, Dow Corning offers a reliable global supply base for industrial and energy electronics solutions, as well as world-renowned customer service. If you are looking for application expertise and support please contact us. We can help you improve the reliability and value of your design, whether it involves the manufacture, assembly, protection or enhancement of power electronic components and systems.

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Powering advances in power electronics

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