Dow Corning Cookie Policy

We use cookies to enhance your experience with Dow Corning. Learn how cookies are used on this website and view our privacy statement.

By continuing to browse this site, you agree and consent for cookies to be used.

Continue
Silicones from Dow Corning
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Search
Go
Products             Technical Library             Premier Services             About Dow Corning             Careers
The Dow Corning Difference
Markets
Products
What Do You Need To Do?
Tutorials

An Innovative Thermally
Conductive Compound for
High-End Servers

 

Drawing out heat and delivering maximum performance and reliability in computing hardware

For years, electronics manufacturers have explored ways to design slimmer, smaller devices that deliver higher performance and functionality. But as the design becomes more compact, the amount of heat generated within the device increases. To facilitate cooler electronic devices, which in turn allows for more efficient operation and better reliability over its life, Dow Corning has released a new thermally conductive compound solution for electronic modules, including computer MPUs, server applications, and power modules.

Dow Corning® TC-5888 Thermally Conductive Compound is the latest from Dow Corning's innovative and industry leading portfolio of thermally conductive silicones. It combines excellent thermal management for improved electronics reliability, with a flow profile that enhances both productivity and precision.

Key Features and Benefits of Dow Corning® TC-5888 Thermally Conductive Compound include:

  • One-Part Material: No cure is required when applying the material.

  • Excellent Stay-ability: Features unique rheological properties that limit its flow beyond a target interface once assembled. This flow characteristic distinguishes it from lower viscosity thermal compounds, and provides greater control for applications requiring a thicker thermal compound layer or greater precision when dispensing compound between surface interfaces.

  • Thermal Stability: Delivers consistent performance and reliability under high temperatures.

  • Good Processability: Offers low volatile content versus competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall.

Contact us today to learn more about how this advanced thermally conductive compound solution can further your electronics applications.

Product Data Sheet and Product Information

Dow Corning® TC-5888 Thermally Conductive Compound Data Sheet (PDF)

Dow Corning® TC-5888 Thermally Conductive Compound Product Information (PDF)

Quick Links
Find Literature Find products
Read Latest News Locate a distributor
 
Enhance thermal management

Silicones help keep
devices cool

 
Ask an expert

Have a question about how Dow Corning can help with your specific business need or application?
 
Ask an expert

Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites         
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2017 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation, a wholly owned subsidiary of The Dow Chemical Company.
The Corning portion of the Dow Corning trademark is a trademark of Corning Incorporated, used under license. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.®™Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow.
Dow Corning complies with the California Transparency in Supply Chains Act.