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Silicones from Dow Corning
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High-Purity Silicones
for Semiconductor
Assembly and Packaging

 

IMAGINE: Improving the processing, performance
and reliability of IC chips

The semiconductor back-end faces constant and emerging challenges including novel manufacturing technologies, the continued reduction in bond pad pitch, the emergence of multichip packages and package-on-package assemblies, and perpetual demand for more I/Os.

These trends are fueling more technologically sophisticated and environmentally friendly manufacturing processes, as well as new device architectures that deliver increased performance and uncompromising reliability. Dow Corning designed its broad portfolio of proven silicon-based thermal interface materials, die attach adhesives, lid seal adhesives, die encapsulants and conformal coatings to help you meet these evolving industry demands. Delivering consistent performance in the most extreme chip-manufacturing environments, they offer numerous benefits, including:

  • High purity
  • Improved stress relief
  • High thermal stability
  • Excellent chemical resistance
  • Low moisture absorption
  • Strong environmental protection
  • Faster, simpler processing
  • Improved cost of ownership
  • Compliance with environmental regulations

As a leading supplier of silicones for more than seven decades, Dow Corning has an established record for delivering targeted properties consistently, with batch-to-batch reproducibility and backed by certified data and 24/7 global technical support. Count on us for a host of analytical and technical services ranging from material qualification and testing through manufacturing start-up and equipment recommendations. Our extensive knowledge of materials and processes can often translate into manufacturing and process efficiencies for you.

More than a world-class materials supplier, Dow Corning is an expert and dedicated collaborator. If our product finder cannot identify an off-the-shelf solution that meets your precise specifications or if you are looking for application expertise and support please contact us.

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Second Award for New Dow Corning® TC-3040 Gel

"One of the 100 most technologically significant new products of the year"
 
Award-winning
thermally
conductive gel


Dow Corning® TC-3040
Thermally Conductive Gel
earned 3D InCites Award

 
For cooler device
packaging


Improve heat dissipation
in high performance
computing

 
High-purity silicones for semiconductor assembly and packaging

Improve the processing, performance and reliability of IC chips
 
Ask an expert

Have a question about how Dow Corning can help with your specific business needs or materials for electronics applications?
 
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