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IMAGINE: Strong bonds that cool components

Strong bonds that cool componentsThe heat is on printed circuit boards and assemblies as the number density and operating frequencies of components increases. As temperatures challenge conventional adhesive materials, Dow Corning offers high-performance silicone solutions that can expand options for integration yet optimized processing and system costs.

Our market leading thermal adhesives range from low-viscosity liquids to non-slump formulations, and are available in two cure chemistries to meet your needs:

  1. One-part moisture-cure grades offer simple room-temperature processing to minimize equipment needs
  2. One-or two-part heat-cure solutions help accelerate processing and throughput

Our heat-cure, thermally conductive silicones develop no significant by-products during processing, making them ideal for confined applications, and they do not need mechanical fasteners or clamps. After cure, they convert into strong yet flexible elastomers, and deliver good unprimed adhesion to a variety of common substrates including metals, ceramics and filled plastics. A range of thermally conductive materials with the highest performing grades delivering thermal conductivity as high as 6.8 W/mK.

Dow Corning® thermally conductive silicone adhesives enhance design and manufacturing flexibility by filling oddly-shaped gaps, reducing interfacial resistance and achieving extremely uniform bond lines, while compensating for board deviation and minor warping.

More than a world-class materials supplier, Dow Corning is an expert and dedicated collaborator. If our product finder cannot identify an off-the shelf solution that meets your precise specifications, or if you are looking for application expertise and support please contact us. Dow Corning’s expertise in thermally conductive silicones adhesives has helped drive customer success in applications across several end-markets, including automotive, consumer, communications, industrial and energy and LED lighting.

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