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Silicones from Dow Corning
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IMAGINE: Reliable, low-stress bonds for long component life

Reliable, low-stress bonds for long component lifeFor over seven decades, Dow Corning has innovated proven adhesive solutions for the entire electronics value chain. Our industry-leading materials offer a unique combination of strength, durability and stress relief for semiconductor die attach and lid seal applications, thermally conductive products for heat management, and easily processed adhesives for bonding module lids.

As a class of materials, Dow Corning® silicone adhesives form flexible bonds versus organic alternatives, helping to minimize mechanical stress caused by thermal cycling, impact and vibration. Our silicones retain their flexibility in the toughest environments, enduring everything from extreme humidity to temperature changes from -45°C to 200°C.

Most Dow Corning adhesives deliver excellent unprimed adhesion to a variety of common substrates, and offer multiple processing options encompassing one-part moisture-cure grades – for simple, cost-efficient room-temperature processing – and one-or two-part heat-cure solutions for enhanced productivity.

More than a world-class materials supplier, Dow Corning is an expert and dedicated collaborator. If our product finder cannot identify an off-the shelf solution that meets your precise specifications, or if you are looking for application expertise and support please contact us.

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