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Dow Corning® brand DA-6534 Adhesive


One part, silver-filled, heat-curable silicone adhesive

Heat and pressure are no match for Dow Corning ® brand DA-6534 Adhesive. This innovative, state-of-the-
science TIM adhesive is Dow Corning’s newest TIM product, offering the highest performance for your application.

DA-6534 combines the ultra low thermal resistance and exceptional adhesive strength into a single high performance packaging material.

Characteristics of this special formulation are:

  • Applicable between chip and lid, as a conductive die or as component attachment
  • Lack of by-products
  • Inertness
  • Good moisture resistance

Effect of Environmental Aging on Thermal Properties

ItemsValue
Viscosity @25C94Pa-s
Thixo ratio @25C2.0
Heat cure time150C/2hrs
Density (As cured)4.41 g/cm3
Durometer (JIS Type A)90
Modulus125 MPa
Thermal conductivity6.4 W/mk
Thermal resistance0.09 cm2-C/W @24um
Lap shear strength (AI/AI)145 N/cm2 (CF)
CTE100 ppm
Ionic impurities (Na+,K+,CI-)<2.0 ppm
Moisture uptake0.03wt%
Thermal Sample Kit
Discover the
Thermal Sample Kit

 

BLT vs. Thermal Impedance chartTime vs. CTC

 

For more information, view our press release from May 8, 2007.

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