| Electronic fuel injection systems –
electronic controllers for injection systems can strongly benefit from silicone
materials for protection and heat dissipation, as well as for lid adhesion or
component fixing. Click below to get a technical overview of the materials you
can pick from and contact Dow Corning to learn about the wide range of reliable
materials that are truly proven in their performance. |
 | Thermal interface - Wet
dispensed |
| Dow Corning supplies a
line of thermally conductive materials, including curing adhesives, gels and
encapsulants, plus non-curing compounds. The materials are supplied as liquids
and pastes that are dispensed or printed when used. |
| Thermal interface -
Pads and films |  |
| Dow Corning supplies many types of
thermal interface materials such as fabricated films and pads, which do not
need to be dispensed or cured. These include thin thermal pads, gap
fillers and phase change films. Fabricated films and pads are supplied ready to
use for those who prefer not to utilize curing processes. |
 | Gels |
| Gels are a special class of
encapsulants that cure to an extremely soft material. Cured gels retain
much of the stress relief and self-healing qualities of a liquid while
providing the dimensional stability of an elastomer. |
| Adhesives and
Sealants |  |
| Adhesives are used primarily to attach
components, such as module lids and baseplates, within electronic modules and
to seal openings in a module to exclude dirt, water or other contaminants. |
 | Conformal coatings |
| Conformal coatings are materials
applied in thin layers, typically a few mils or a fraction of a mm, onto
printed circuits or other electronic substrates. These materials provide
environmental and mechanical protection to significantly extend the life of the
components and circuitry. |
Change
