| HID electronic igniters & ballasts –
high intensity discharge igniters and ballasts create a lot of heat and
function in harsh environments. Dow Corning has a very wide range of thermal
interface materials, as well as materials to encapsulate, coat and adhere
electronic components and modules. |
 | Thermal interface - Wet
dispensed |
| Dow Corning supplies a
line of thermally conductive materials, including curing adhesives, gels and
encapsulants, plus non-curing compounds. The materials are supplied as liquids
and pastes that are dispensed or printed when used. |
| Thermal interface –
Pads and films |  |
| Dow Corning supplies many types of
thermal interface materials such as fabricated films and pads, which do not
need to be dispensed or cured. These include thin thermal pads, gap fillers and
phase change films. Fabricated films and pads are supplied ready to use for
those who prefer not to utilize curing processes. |
 | Gels |
| Gels are a special class of
encapsulants that cure to an extremely soft material. Cured gels retain much of
the stress relief and self-healing qualities of a liquid while providing the
dimensional stability of an elastomer. |
| Adhesives and
Sealants |  |
| Adhesives are used primarily to attach
components, such as module lids and baseplates, within electronic modules and
to seal openings in a module to exclude dirt, water or other contaminants. |
 | Conformal coatings |
| Conformal coatings are materials
applied in thin layers, typically a few mils or a fraction of a mm, onto
printed circuits or other electronic substrates. These materials provide
environmental and mechanical protection to significantly extend the life of the
components and circuitry. |
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