| LED headlamp assemblies – mounting HBLEDS
in a headlamp assembly require high performance thermal interface materials to
keep the LED temperature at an acceptable level Dow Corning is active in
various parts of the value chain relative to LED’s invites you to click below
and learn about the proven material solutions available. |
 | Thermal interface - Wet
dispensed |
| Dow Corning supplies a
line of thermally conductive materials, including curing adhesives, gels and
encapsulants, plus non-curing compounds. The materials are supplied as liquids
and pastes that are dispensed or printed when used. |
| Thermal interface -
Pads and films |  |
| Dow Corning supplies many types of
thermal interface materials such as fabricated films and pads, which do not
need to be dispensed or cured. These include thin thermal pads, gap fillers and
phase change films. Fabricated films and pads are supplied ready to use for
those who prefer not to utilize curing processes. |
 | Adhesives and
Sealants |
| Adhesives are used primarily to attach
components, such as module lids and baseplates, within electronic modules and
to seal openings in a module to exclude dirt, water or other contaminants. |
| LED Materials |  |
| These materials, designed for
High-Brightness LED packages, are used for protection, light-extraction,
thermal management and as molded lenses to direct light output. |
 | Optical assembly
materials |
| Dow Corning silicon-based materials
have unique properties that make them well suited for use in a variety of
optical devices, including high performance optical components, optical data
storage, optical fiber coatings, and high brightness LED packaging. |
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