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Dow Corning offers many approaches for solutions in die attach materials. Both Dow Corning® and Dow Corning Toray Silicone® brand materials offer superior moisture resistance, low alpha emittance, physical and electrical stability, compatibility with other Dow Corning and Dow Corning Toray Silicone brand materials and excellent compliancy in use.
Dow Corning Die Attach materials offer:
Special Properties
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Moisture pickup 236 hours
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Non-halogen containing
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Lead free temperature capability (confirmed to 260C)
Physical Form
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One-part cured elastomer, between release liners
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One-part thixotropic paste, stencil printable
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One or two-part thixotropic paste, dispensible (non-conductive)
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One-part thixotropic paste, dispensable or stencil printable (electrically conductive)
Potential Uses
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Adhere, protect, preserve electrical characteristics of micro-electronic devices
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Stencil printable as spacer to make standoff height for varying package types
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Die attach for stress sensitive die
Additional information is available at the Die Attach Adhesives tutorial.
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