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Primary uses of Dow Corning® and Dow Corning Toray Silicone® encapsulants are to seal, protect, and preserve electrical characteristics of integrated circuit packages. This a dispensable underfill effectively relieving stress caused by the CTE
(coefficient of thermal expansion) mismatch between the silicon die and the substrate. These products have been successfully demonstrated with typical dispensing or liquid injection molding equipment.
Dow Corning Encapsulants offer:
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Fast underflow time useful for larger devices
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Chemical adhesion to most common substrates with superior moisture resistance
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Compliancy for stress sensitive CTE mismatches
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Retains flexibility at high and low temperatures
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High ionic purity
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Very low alpha particle emissions needed for DRAM applications
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Excellent electrical properties over wide operating temperature and frequency ranges
Additional information is available at the Die Encapsulants tutorial.
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