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Silicones from Dow Corning
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Chemical Vapor Deposition

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Materials for Electronics - Encapsulants

Silicone encapsulants and potting materials from Dow Corning are elastomers that provide excellent stress relief and stable physical and electrical properties over a wide temperature range. They can be formulated for fast room temperature cures for improved processing and with high thermal conductivity for component performance.

Many Dow Corning encapsulants provide excellent adhesion to common substrates after cure.

Silicone encapsulants and potting materials offer:

  • Long-term performance
  • Stress relief for underlying circuitry
  • Processing flexibility
  • Easy repairability
  • Good clarity
  • Excellent fire resistance
  • Strong, positive, unprimed adhesion to most common metals and plastics used in electronics applications, including epoxy glass laminates used in circuit boards

Additional information is available at the Encapsulants or the Gels tutorial.

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  1. Materials for Electronics

  2. Materials for Electronics - Adhesives and Sealants

  3. Materials for Electronics - Conformal Coatings

  4. Materials for Electronics - Encapsulants

  5. Materials for Electronics - Primers

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