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Silicone encapsulants and potting materials from Dow Corning are elastomers
that provide excellent stress relief and stable physical and electrical
properties over a wide temperature range. They can be formulated for fast room
temperature cures for improved processing and with high thermal conductivity
for component performance.
Many Dow Corning encapsulants provide excellent adhesion to common substrates
after cure.
Silicone encapsulants and potting materials offer:
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Long-term performance
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Stress relief for underlying circuitry
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Processing flexibility
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Easy repairability
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Good clarity
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Excellent fire resistance
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Strong, positive, unprimed adhesion to most common metals and plastics used in
electronics applications, including epoxy glass laminates used in circuit
boards
Additional information is available at the Encapsulants or the Gels tutorial.
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