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Silicone gels from Dow Corning can be used as encapsulants or potting
materials that provide excellent stress relief and stable physical and
electrical properties over a wide temperature range. They can be formulated
for fast room temperature cures for improved processing and are available as
one or two part formulations.
Most Dow Corning gels provide excellent adhesion to common substrates after
cure.
Silicone gels offer:
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Long-term performance
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Stress relief for underlying circuitry
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Processing flexibility
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Easy repairability
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Good clarity
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Excellent fire resistance
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Strong, positive, unprimed adhesion to most common metals and plastics used in
electronics applications, including epoxy glass laminates used in circuit
boards
Additional information is available at the Encapsulants or the Gels tutorial.
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