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Archived News
Past editions of Electronics News
Dow Corning Electronics Awards Ellsworth Adhesives North American 2007 Distributor of the Year
Jeroen Bloemhard, Global Executive Director, Electronics and Advanced Technologies featured in Semiconductor International "Executive Outlook" January 2008 issue
New Silicon-Infused Bilayer Photoresist Developed By TOK and Dow Corning Electronics Being Used In IC Memory Production
Dow Corning Electronics’ New Thermally Conductive Compound Offers Electronics Makers Affordable, Effective Conductivity
SMT’s October E-newsletter Highlights Contributed article from Dow Corning’s Electronics Protection Market
Dow Corning Electronics’ Silicon Lithography Solutions Article Makes Editor’s Pick!
Dow Corning Electronics’ New TC-5026 Thermal Grease Offers Electronics Makers Improved Conductivity And Reliability
Sustainability, stewardship in the supply chain
Silicon-Containing materials for Sub-65 nm Etch
- a Device Fabrication Technical Paper
Dow Corning Compound Semiconductor Solutions Wins Additional U.S. Navy Funds for Semiconductor Silicon Carbide Development
Midland Daily News Interviews Dow Corning Electronics' Ken Seibert
Dow Corning Electronics Appoints Advanced Technologies and Ventures Business Leaders to Address Market Opportunities and Growth in Asia
Dow Corning Advanced Technologies and Ventures Business Sponsors University Of Michigan Solar Car Team To Compete In October’s World Solar Challenge In Australia
ATVB's Jeroen Bloemhard featured in "2007 Semicon West Executive Outlook" feature for
Semiconductor International Magazine
Dow Corning Electronics Improves Flip-Chip Adhesive Process Speed, Temperature Performance
Dow Corning Electronics featured in
Semiconductor International
's June 2007 article "Characterization Challenges of New Materials"
- a Device Fabrication Technical Paper
High Performance Silicone Materials for High Brightness LEDs
- a LED Technical Paper (PDF size = 229 KB)
Dow Corning to Receive Intel Preferred Quality Supplier Award
Dow Corning Sponsors China Electronics Summit 2006
Dow Corning and Tokyo Ohka Kogyo Develop Silicon-Infused Bilayer Photoresist,
Achieving Higher Etch Selectivity and Simplifying Sub-65nm Lithography
Silicones suit TPMS electronics reprinted from
Automotive Engineering International
September 2006 issue
Cool It! From grease to films to carbon fibers, engineers have many options for keeping microprocessors cool reprinted from
Assembly Magazine
August 2006 issue
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