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Improve your integrated circuit packaging and protection by using a wide
range of ultra-high-purity materials from Dow Corning. Integrated circuit
packages gain full compliancy, outstanding stress relief, and reliability over
a wide temperature range and moisture resistance when using Dow Corning® brand
silicone die attach and encapsulation products. And you can improve
protection by using HIPEC® brand protective, passivating coatings that we
developed specifically for semiconductor applications.
We also offer Photoneece™ Polyimides for use as a stress buffer and/or
redistribution layer in the production of semiconductors, and coatings used as
an insulating layer for the production of OLEDs.
¹Photoneece™ is a registered trademark of Toray Industries.
Silicon Manufacturing
Semiconductor
Fabrication
Macroelectronic Circuit/Module Protection and
Assembly
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