Silicones from Dow CorningWe help you invent the future.
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Search
Go
Products             Technical Library             Premier Services             About Dow Corning             Careers
Electronics Products
Electronics Solutions
Product Resources
Technical Resources

Chemical Vapor Deposition


The Right Chemical Vapor Deposition (CVD) Solutions


Solve your most difficult challenges now and tomorrow. Dow Corning is committed to develop and commercialize new molecules for all your next-generation, thin-film deposition needs.

Your benefits with Dow Corning:

  • Develop the most challenging aspect ratios
  • Reduce your thermal budgets
  • Meet your electrical properties and mechanical property requirements
  • Benefit from 60 years of silicon material and technical support expertise
  • Get innovative solutions for your current and future challenges

Our expertise at your service:

  • Get both spin-on and CVD low-ĸ (<3) dielectric materials for IC fabrication from a leading and reliable supplier
  • 100% vertical integration from starting materials (sand) to semiconductor-grade silicon-based gases and chemicals
  • Basic materials research and development, with pilot sampling through large-scale chemical production performed throughout a globally integrated organization
  • Numerous tier-one customer audits successfully completed
  • A leading producer of specialty chemicals: organosilanes, siloxanes, silicon-based resins and polymers 
 

For additional information on chemical vapor deposition, as well as processing solutions, see:

Low-ĸ and Copper Barrier Overview
Type: Multifunctional CVD precursor
Physical Form: Silicon source specialty gas/liquid
Typical Molecules: Z3MSTM, Z4MSTM, ZTOMCATSTM, Z2DMTM, organosilanes, organosiloxanes, others
Special Properties: High purity; semiconductor grade
Typical Molecules: ZHCDS (hexachlorodisilane), chlorosilanes, others
Potential Uses: Formation of front end-of-line low-temperature deposition of thin films (i.e., silicon oxide, silicon nitride, epitaxial silicon, poly silicon, etc.); typical applications include spacer nitrides, spacer oxides, etch stop, cap nitride, STI liner, engineered source/drain and engineered substrates
Technical Data Download Data Sheet PDFTutorial

Low-Temperature Overview
Type: Multifunctional CVD precursors
Physical Form: Silicon source specialty liquid
Typical Molecules: ZHCDS (hexachlorodisilane), chlorosilanes, others
Special Properties: Highly reactive molecules; high purity; semiconductor grade
Potential Uses: Formation of front end-of-line low-temperature deposition of thin films (i.e., silicon oxide, silicon nitride, epitaxial silicon, poly silicon, etc.); typical applications include spacer nitrides, spacer oxides, etch stop, cap nitride, STI liner, engineered source/drain and engineered substrates
Technical Data Download Data Sheet PDFTutorial

High-ĸ Overview
Type: Multifunctional CVD precursors
Physical Form: Silicon source specialty liquid
Typical Molecules: Aminosilanes, chlorosilanes, others
Special Properties: High purity; semiconductor grade
Potential Uses: Formation of silicon oxide or metal silicates; typical applications include logic gate oxide and memory capacitor oxide
Technical Data Download Data Sheet PDFTutorial

Gap Fill Overview
Type: Multifunctional CVD precursor
Physical Form: Silicon source specialty liquid
Typical Molecules: Organosilanes, organosiloxanes, others
Special Properties: High purity; semiconductor grade
Potential Uses: Formation of silicon oxide thin-film dielectrics; typical film applications include shallow trench isolation (STI) and pre-metal dielectric (PMD) gapfill
Technical Data Download Data Sheet PDFTutorial

PDF Links will download files in Adobe Acrobat PDF format. For technical information, or to download the free Acrobat Reader, go to Acrobat help.

< back to Electronics Solutions Home Page  
Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2013 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.