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With electrical conductivity

With low values of volume resistivity

To dissipate heat from the device with good thermal conductivity

That are highly filled as indicated by low values of volume resistivity and high values of specific gravity

That is electrically insulative to provide isolation for the device

With high values for dielectric strength

That can be applied without the need for dispense equipment

That are preformed films

For use around heat-sensitive components that cannot withstand high cure temperatures

That cure at temperatures less than 100C

For rapid processing

With fast cure times

With low levels of outgassing

Designated as having “controlled volatility” (CV) properties

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