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Dow Corning offers two approaches for chip scale packages in die attach. Both
Dow Corning® and Dow Corning Toray Silicone® brand materials
offer superior moisture resistance, low alpha emittance, physical and
electrical stability, compatibility with other Dow Corning and Dow
Corning Toray Silicone brand materials and excellent compliancy in use.
| Type:
Pre-formed, elastic, dry film type adhesive
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| Physical Form:
Pre-formed film adhesive covered with liners on both sides, supplied on a
reel, packed in a sealed aluminum bag
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| Special Properties:
Easily handled pre-formed film, no migration, low Young's modulus, excellent
adehsion, thermal stability and insulating properties, high purity
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| Potential Uses:
Dry film adhesive for semiconductor applications such as die to substrate
attach
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| Technical Data |
Download Datasheet PDF
| Tutorial |
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| Type:
One-part, stencilable
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| Physical Form:
Thick paste, thixotropic
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| Special Properties:
: Operating temperature –80 to 200°C (-112 to 392°F); moisture pickup 236 hours
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| Potential Uses:
Stencilable as spacer to make standoff for μBGA package
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| Technical Data |
Download Datasheet PDF
| Tutorial |
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| Type:
One-part, stencilable silicone elastomer
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| Physical Form:
Thixotropic; cures to compliant elastomer
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| Special Properties:
Excellent adhesion, maintains flexiblity at high and low temperatures, low
moisture absorption, high purity, self priming, excellent stress relief
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| Potential Uses:
Electrically conductive, die attach adhesive for stress-sensitive die or
packaging; Thermally conductive adhesive for heat sensitive die or packaging
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| Technical Data |
Download Datasheet PDF
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Tutorial
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