|
Features
One part heat cure, thixotropic, excellent adhesion to most common
substrates with moisture resistance, excellent electrical conductivity and
thermal conductivity, maintains flexiblity at high and low temperatures, low
moisture absorption, compliant adhesive for stress sensitive CTE mismatches,
high purity, self priming, and excellent stress relief.
Potential Uses
Electrically conductive, die attach adhesive for stress sensitive die or
packaging.
Thermally conductive adhesive for heat sensitive die or packaging.
Electrically conductive adhesive between crystal and electrode of crystal
oscillator.
Thermal interface material for conducting heat through heat spreader.
PDF Links will download files in Adobe Acrobat PDF format. For technical
information, or to download the free Acrobat Reader, go to Acrobat help.
Technical
Data
Tutorial
|