Die Encapsulants

HIPEC® R 6101 Semiconductor Protective Coating

One-Part, heat cure, clear, good flowability, soft elastomer, self priming adhesion

Excellent adhesion, light transmission, flexible at high and low temperatures

Protection of discrete devices such as transistors and rectifiers

HIPEC® R 6102 Semiconductor Protective Coating

One-Part, heat cure, black, good flowability, soft elastomer, self priming adhesion

Excellent adhesion, blockage for light sensitive devices, flexible at high and low temperatures

Protection of discrete devices such as transistors and rectifiers

Dow Corning® JCR 6224

One-Part, heat cure, black, thixotropic, DRAM grade

Excellent workability, long pot life at room temperature, excellent printing capability; excellent adhesion, thermal stability and electrical properties

Good flowability encapsulant for chip scale packages that require DRAM-grade purity

HIPEC ® Q1-4939 Semiconductor Protective Coating

Two-Part, heat cure, clear, cures to elastomer or gel depending on mix ratio, good flowability

Solventless silicone gel or elastomer; protection from thermo-mechanical shock

Sealing, preserving and protecting complex, integrated circuits

HIPEC® Q1-9239 Semiconductor Protective Coating

One-Part, heat cure, black, controlled thixotropy-flowable as dispensed, self priming adhesion

Fast heat cure; excellent adhesion; flexible over wide temperature range

For applications where a semiconductor die has been wire bonded to a flat surface

HIPEC ® Q3-6646 Semiconductor Protective Coating

Two-Part, heat cure gel, clear, very low viscosity, long working time, enhanced low temp capability

Solventless silicone gel or elastomer; protection from thermo-mechanical shock

Sealing, preserving and protecting complex, integrated circuits