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Die Encapsulant Benefits of Silicone - CTE

Coefficients of Thermal Expansion

Material

10-6 (cm/cm)/°C

Unfilled silicone

320

Filled silicone

125-275

Unfilled epoxies

100-200

Filled epoxies

50-125

PWB (xy axis)

12-16

Silicon

2.4

Polyimide

28

Source: Electronic Packaging and Interconnection Handbook

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< back to Die Encapsulants Home Page  
 
  1. Die Encapsulant Tutorial


  2. Die Encapsulant Tutorial - Product Selection


  3. Die Encapsulant Tutorial - Product Quality


  4. Die Encapsulant Processing Tutorial


  5. Die Encapsulant Processing Tutorial - Atmospheric Dispense


  6. Die Encapsulant Processing Tutorial - Vacuum Dispense


  7. Die Encapsulant Benefits of Silicone Tutorial


  8. Die Encapsulant Benefits of Silicone Tutorial -Thermal Properties


  9. Die Encapsulants Benefits of Silicone - Moisture Permeability


  10. Die Encapsulant Benefits of Silicone - Modulus vs Temp


  11. Die Encapsulant Benefits of Silicone - CTE
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