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Encapsulation Materials — Product Selection
Selection of the proper encapsulant used in a chip-scale package has become increasingly difficult due to:
1. The different chemistry sets in wide usage, specifically epoxies.
2. Different process types.
3. Special processing precautions unique to silicone materials.
Dow Corning professionals are available to assist you in selecting the best encapsulant for your specific application. All encapsulation processes and project goals should be reviewed with our technical staff prior to selection.
The following services are offered by Dow Corning:
Product Recommendations
After reviewing project details and specifications, Dow Corning will assist in the selection of the proper Dow Corning® brand Silicone Encapsulant.
Performance Testing
Dow Corning will evaluate the materials to a set of specific properties and any property requested by the customer.
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Cure testing
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Adhesion testing
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Ionics testing
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Electrical testing
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