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Die Encapsulants


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Die Encapsulant Processing Tutorial

Processing Dow Corning® Brand Silicone Encapsulants

Great strides have been made in both process and product. The key is making them work together.

The use of silicone materials in the production of the micro-BGA packaging created some new equipment needs to enable high-speed/high-yield processing. The challenges to manufacturing, speed of dispense, and void-free encapsulation are brought about by the same things that make silicones excellent in reliability.

There are two dispensing methods currently being used on Dow Corning® brand Silicone Encapsulants. Atmospheric dispense, which depends on the autoclave to assist in eliminating voids after dispense. The second method is vacuum dispense, which utilizes high flow properties to shorten process time.

A third method of encapsulation is also under evaluation. This method uses the Camelot 3950 Vacuum Injection Machine. This piece of equipment should result in lower cost and higher throughput, because parts will need less spacing between them.

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< back to Die Encapsulants Home Page  
 
  1. Die Encapsulant Tutorial


  2. Die Encapsulant Tutorial - Product Selection


  3. Die Encapsulant Tutorial - Product Quality


  4. Die Encapsulant Processing Tutorial


  5. Die Encapsulant Processing Tutorial - Atmospheric Dispense


  6. Die Encapsulant Processing Tutorial - Vacuum Dispense


  7. Die Encapsulant Benefits of Silicone Tutorial


  8. Die Encapsulant Benefits of Silicone Tutorial -Thermal Properties


  9. Die Encapsulants Benefits of Silicone - Moisture Permeability


  10. Die Encapsulant Benefits of Silicone - Modulus vs Temp


  11. Die Encapsulant Benefits of Silicone - CTE


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