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Processing Dow Corning® Brand Silicone Encapsulants
Great strides have been made in both process and product. The key is making
them work together.
The use of silicone materials in the production of the micro-BGA packaging
created some new equipment needs to enable high-speed/high-yield processing.
The challenges to manufacturing, speed of dispense, and void-free
encapsulation are brought about by the same things that make silicones
excellent in reliability.
There are two dispensing methods currently being used on Dow Corning® brand
Silicone Encapsulants. Atmospheric dispense, which depends on the autoclave to
assist in eliminating voids after dispense. The second method is vacuum
dispense, which utilizes high flow properties to shorten process time.
A third method of encapsulation is also under evaluation. This method uses the
Camelot 3950 Vacuum Injection Machine. This piece of equipment should result
in lower cost and higher throughput, because parts will need less spacing
between them.
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