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Die Encapsulants


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Die Encapsulant Processing Tutorial - Atmospheric Dispense

Processing Dow Corning® Brand Silicone Encapsulants — Atmospheric Dispense

The atmospheric dispense has been demonstrated by machines from both Asymtek and Camalot with a 20-gauge needle. The dispense is controlled by dispense height and needle speed. Atmospheric dispense is done using a pattern that dispenses on three sides of the die and after the material has been given time to flow and "wick" underneath the die by capillary action, the fourth side is put down to seal the die.

This method results in a void being trapped underneath the die. The void is small enough that following up with an autoclave collapses the void and leaves a void-free part.

Another option for atmospheric encapsulation is to dispense around all four sides of the die and follow with a vacuum degassing step to remove the void. This will work in theory, but the process of removing the void causes the material to splatter and contaminate the backside of the die.

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< back to Die Encapsulants Home Page  
 
  1. Die Encapsulant Tutorial


  2. Die Encapsulant Tutorial - Product Selection


  3. Die Encapsulant Tutorial - Product Quality


  4. Die Encapsulant Processing Tutorial


  5. Die Encapsulant Processing Tutorial - Atmospheric Dispense


  6. Die Encapsulant Processing Tutorial - Vacuum Dispense


  7. Die Encapsulant Benefits of Silicone Tutorial


  8. Die Encapsulant Benefits of Silicone Tutorial -Thermal Properties


  9. Die Encapsulants Benefits of Silicone - Moisture Permeability


  10. Die Encapsulant Benefits of Silicone - Modulus vs Temp


  11. Die Encapsulant Benefits of Silicone - CTE


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