Die Encapsulants

Benefits of Silicone Based Materials  

Silicones: Silicone encapsulants are based on a stable siloxane backbone with excellent stress relief and other properties under extreme temperatures (-40 to 200°C). Addition cure ensures no byproducts.

Epoxies: Hard, usually opaque, materials that offer adequate moisture resistance. They exhibit good high-temperature stability, but they tend to degrade at low temperatures. They are stiff and can cause mechanical or thermal stress to components.

Property Comparison

	Property		Silicone		Resinous Epoxy
	Modulus		2–10 MPa		4–13 MPa
	CTE ppm/°C		125–275		15–75
	Moisture Uptake		< 0.2 wt %		1–2 wt %
	Tg		-126°C		100-145°C