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Die Encapsulants


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Die Encapsulant Benefits of Silicone Tutorial -Thermal Properties

Thermal Properties

TGA: Thermal gravimetric analysis

  • Typically used to determine thermal stability
  • Analyze at fixed temperature (isothermal) or using a temperature ramp
  • CTE: Coefficient of thermal expansion (dependent on Tg, modulus, and fillers)

 

TMA: Thermal mechanical analysis

  • Expansion in z-direction vs. temperature; CTE is slope of line (distance moved/°C)

DSC: Differential scanning calorimetry

  • Tg-Glass transition temperature (second order transition); material changes from glassy-rubbery
  • Tm-Melt transition (first order transition)
  • Below Tm or Tg materials harden (increase modulus) and CTE changes

 

Other physical property measurements

  • Typically as a function of temperature and time
  • Young’s modulus, tensile, elongation, durometer

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< back to Die Encapsulants Home Page  
 
  1. Die Encapsulant Tutorial


  2. Die Encapsulant Tutorial - Product Selection


  3. Die Encapsulant Tutorial - Product Quality


  4. Die Encapsulant Processing Tutorial


  5. Die Encapsulant Processing Tutorial - Atmospheric Dispense


  6. Die Encapsulant Processing Tutorial - Vacuum Dispense


  7. Die Encapsulant Benefits of Silicone Tutorial


  8. Die Encapsulant Benefits of Silicone Tutorial -Thermal Properties


  9. Die Encapsulants Benefits of Silicone - Moisture Permeability


  10. Die Encapsulant Benefits of Silicone - Modulus vs Temp


  11. Die Encapsulant Benefits of Silicone - CTE


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