Encapsulants

To be used in stress-sensitive applications or for vibration isolation

With low durometer values; or consider gels

For use around heat-sensitive components that cannot withstand high cure temperatures

That cure at room temperature or with moderate heat

For rapid processing

With fast cure times

That will adhere without the need for priming

With higher values of unprimed lap shear or peel strength

With higher strength

With higher tensile or tear strength values

That will fill small spaces

With the lowest viscosity values; or, with higher viscosity products, use vacuum during processing

To minimize leakage from gaps in modules before curing

With higher viscosity values or faster cure times

To minimize the chance for trapping bubbles

With the lowest viscosity values and fill the part on an incline; or, with higher viscosity products, use vacuum during processing

That maintains cured properties at extremely low temperatures

Suited for use below –40C

To assist with heat dissipation

With higher filler levels as indicated by higher specific gravity values

To help tamperproof a module

With higher durometer values

To conceal boards or components within a module

That are pigmented or that are highly filled as indicated by high specific gravity values

With good optical clarity

Designated as “clear”

With very low levels of outgassing

Designated as having “controlled volatility” (CV) properties or as “space grade”

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