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Encapsulants


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Key Characteristics - Encapsulants tutorial

Dow Corning silicone encapsulants generally possess the following characteristics:

  • Minimal shrinkage
  • No heat generated (exotherm) during cure
  • No solvents or cure by-products
  • Deep section cure
  • Repairable
  • Excellent dielectric properties
  • Cures to a flexible, stress-relieving elastomer
  • Cures in confinement
  • Service range of –45° to 200°C (-49°F to 392°F)

Certain products also include such properties as:

  • Fast RT cure
  • Optical clarity
  • High tear strength
  • Enhanced thermal conductivity
  • UL and Mil Spec compliance
  • Enhanced flame resistance
  • Controlled volatility
  • Extreme low temperature performance
 

To find a product with the characteristics you want, check the Product Finder

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< back to Encapsulants Home Page  
 
  1. Encapsulants Tutorial


  2. Solutions for Encapsulants


  3. Key Characteristics - Encapsulants tutorial


  4. Potential Applications - Encapsulants tutorial


  5. Broad Classes of Dow Corning Encapsulants - Encapsulants Tutorial


  6. Thermal Conductivity - Encapsulants Tutorial


  7. Specialty Encapsulants


  8. Specifications and Other Qualifications


  9. Basics of Processing


  10. Curing Methods


  11. Packaging and Storage Considerations


  12. Tell Us What You Need
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