| Dow Corning’s encapsulants can generally be divided into two
broad classes. Roughly half of the products have self-priming
capabilities. When heated to temperatures above 100°C during the cure
process, they can develop adhesion to many common surfaces. The other
products can be termed as standard encapsulants. If adhesion is required,
a separate priming step is needed. For some applications, such as those
where stress relief is the primary requirement, adhesion may not be as critical
and standard encapsulants can be used without the need for
priming. Testing in simulated or accelerated service conditions is
recommended to help judge long term performance. |  |
The table below may help with the choice of which product family best fits
your process or
application.
 | | | | | | |
| | | Standard Heat Curing Encapsulants | | Self-priming Heat Curing Encapsulants | |
| | | | | | |
| Can cure at room temp | | Yes | | No (must be cured above 100C) | |
| | | | | | |
| Cure accelerated by heat | | Yes | | Yes | |
| | | | | | |
| Room Temperature Working Time (Pot Life) | | Good | | Excellent | |
| | | | | | |
| Cure By-Products | | None | | Low levels of alcohols from adhesion additives | |
| | | | | | |
| Needs separate priming step for adhesion | | Yes | | No | |
| | | | | | |
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