| By the addition of higher levels of fillers, the thermal
conductivity of the silicone encapsulants can be increased
significantly. Thermally conductive encapsulants function as heat transfer
media, durable dielectric insulation, barriers against environmental
contaminants and act as stress-relieving shock and vibration absorbers over
wide temperature and humidity ranges. |  |
 | Without the addition of extra fillers, a typical value for the
coefficient of thermal conductivity is roughly 0.1
watts/meter-degK. Special filler addition can result in materials ranging
from 0.5 to greater than 2.5 watts/meter-degK. Check the Product
Finder for a material with the combination of properties to meet the needs
of your application. |
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