Encapsulants

Low Volatility Encapsulants

In some applications, low molecular weight volatiles from the encapsulants can result in problems. This can range from volatiles re-condensing onto surfaces negatively impacting adhesion or optical sensors or can lead to decomposition of volatiles under high voltage conditions. For these cases, special low volatility intermediates are used to formulate Dow Corning’s low volatility products. One of the encapsulants is even designated as space grade.

Extreme Low Temperature Products

Dow Corning ® brand silicone encapsulants can withstand cold environments down to at least –45°C(-49°F). For even colder uses, there are specialized products that will perform down to –70°C.

Flame Resistance

The materials used in certain applications are required to meet special criteria such as those from Underwriters Laboratories for flammability. There are encapsulants, which possess a UL 94V flammability classification.

Optically Clear Materials

For optical applications, there are products that are highly transparent in many wavelength ranges including the visible range.

Condensation Cure Products

Most of Dow Corning’s encapsulants utilize an addition cure mechanism to form the elastomeric network. This addition cure chemistry can be susceptible to cure inhibition from chemicals sometimes present in electronic processes or components. In these cases, it is recommended that condensation cure encapsulants, which are not sensitive to inhibition, be specified for cure sensitive applications. These materials also have an advantage of curing rapidly at room temperature. However, they have a limited range of working times and cure speeds and are not as versatile for processing compared to the heat curing encapsulants.