Dow Corning Cookie Policy

We use cookies to enhance your experience with Dow Corning. Learn how cookies are used on this website and view our privacy statement.

By continuing to browse this site, you agree and consent for cookies to be used.

Continue
Silicones from Dow Corning
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Search
Go
Products             Technical Library             Premier Services             About Dow Corning             Careers
Electronics Products
Tutorials
Applications
Electronics Solutions
Product Resources
Technical Resources

Encapsulants


<  1  2  3  4  6  7  8  9  11  >
Specialty Encapsulants

Certain applications are uniquely sensitive and require specialized properties of the encapsulants. 

Low Volatility Encapsulants

In some applications, low molecular weight volatiles from the encapsulants can result in problems. This can range from volatiles re-condensing onto surfaces negatively impacting adhesion or optical sensors or can lead to decomposition of volatiles under high voltage conditions. For these cases, special low volatility intermediates are used to formulate Dow Corning’s low volatility products. One of the encapsulants is even designated as space grade.

Extreme Low Temperature Products

Dow Corning ® brand silicone encapsulants can withstand cold environments down to at least –45°C(-49°F). For even colder uses, there are specialized products that will perform down to –70°C.

Flame Resistance

The materials used in certain applications are required to meet special criteria such as those from Underwriters Laboratories for flammability. There are encapsulants, which possess a UL 94V flammability classification.

Optically Clear Materials

For optical applications, there are products that are highly transparent in many wavelength ranges including the visible range.

Condensation Cure Products

Most of Dow Corning’s encapsulants utilize an addition cure mechanism to form the elastomeric network. This addition cure chemistry can be susceptible to cure inhibition from chemicals sometimes present in electronic processes or components. In these cases, it is recommended that condensation cure encapsulants, which are not sensitive to inhibition, be specified for cure sensitive applications. These materials also have an advantage of curing rapidly at room temperature. However, they have a limited range of working times and cure speeds and are not as versatile for processing compared to the heat curing encapsulants.

<  1  2  3  4  6  7  8  9  11  >

< back to Encapsulants Home Page  
 
  1. Encapsulants Tutorial


  2. Solutions for Encapsulants


  3. Key Characteristics - Encapsulants tutorial


  4. Potential Applications - Encapsulants tutorial


  5. Thermal Conductivity - Encapsulants Tutorial


  6. Specialty Encapsulants


  7. Specifications and Other Qualifications


  8. Basics of Processing


  9. Packaging and Storage Considerations


Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2017 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation, a wholly owned subsidiary of The Dow Chemical Company.
The Corning portion of the Dow Corning trademark is a trademark of Corning Incorporated, used under license. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.®™Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow.
Dow Corning complies with the California Transparency in Supply Chains Act.