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Gels


Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry.  Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:

  • Functioning as dielectric insulation
  • Protecting the circuit from moisture and other contaminants
  • Relieving mechanical and thermal stress on components

Dow Corning offers a line of standard gels,
a line of low-temperature gels for applications requiring low-temperature performance.
A line of toughened gels for use where chemical adhesion and dimensional stability are required,
and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels.
In addition, Dow Corning offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.

Learn more from the Gels Tutorial or if you are looking for processing information please refer to the Gels and Encapsulants Processing Tutorial.

PDF Links will download files in Adobe Acrobat PDF format. For technical information, or to download the free Acrobat Reader, go to Acrobat help.

Standard Gels Overview:
Type: Two-part, various cure speeds
Physical Form: 1:1 mix ratio by weight or volume, various viscosities
Special Properties: Cure accelerated by heat, wide operating temperature range (-45 to 150°C/-49 to 302°F)
Potential Uses: Sealing and protecting, by coating, encapsulating, or potting, various electronic devices, especially those with delicate components
Technical DataGels Tutorial

Low Temperature Gels Overview:
Type: One or two-part, various cure speeds
Physical Form: 1:1 mix ratio by weight or volume, various viscosities
Special Properties: Cure accelerated by heat, wider operating temperature range than the other types of gels (-80 to 200°C/-112 to 392°F)
Potential Uses: Sealing and protecting, by coating, encapsulating, or potting, various electronic devices, especially those with delicate components and exposure to low temperatures
Technical DataGels Tutorial

Toughened Gels Overview:
Type: Two-part, various cure speeds
Physical Form: 1:1 mix ratio by weight or volume, low viscosity
Special Properties: Chemical adhesion, dimensional stability, cure accelerated by heat, wide operating temperature range (-45 to 150°C/-49 to 302°F)
Potential Uses: Sealing and protecting, by coating, encapsulating, or potting, various electronic devices, especially those with a need for stronger adhesion or improved dimensional stability; Dow Corning® 3-4237 Dielectric Firm Gel, with its exceptionally long working time, is especially suited for penetrating intricate parts
Technical DataGels Tutorial

Specialty Gels Overview:
Type: One or two-part, various cure speeds
Physical Form: 1:1 mix ratio by weight or volume
Special Properties: Cure accelerated by heat or initiated by UV exposure, low extractables, resistance to solvents and fuels, wide operating temperature range (at least -45 to 150°C/-49 to 302°F)
Potential Uses: Sealing and protecting various electronic devices by coating, encapsulating, or potting. Especially adapted to those with delicate com­ponents and a need for low extractables, UV cure, or resistance to solvents and fuels.
Technical DataGels Tutorial

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