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For Potting Modules, select one of Dow Corning's Gels or Encapsulants. Here
are some items for considerations in choosing the appropriate material for
your use:
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Dow Corning offers a wide range of silicone gels. Some are designed for use at
extremely low temperatures or for better solvent resistance. There is also a
new family of gels called firm or tough gels. With added chemical adhesion,
these materials can be used where extra bonding to surfaces is important and a
greater degree of physical integrity to the material is desired. Soft gels are
often used for sensitive circuits needing the highest levels of stress relief
and vibration dampening.
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Elastomeric encapsulants are used for modules that need greater mechanical
protection.
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One-part materials are easier to handle, two-part materials often offer faster
processing. Two-part materials are typically 1:1 mix ratio with a few at 10:1.
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Heat cures offer higher throughput and faster processing times. Heat cure
times typically are shorter with increasing temperatures. If heat cure is not
practical, choose a room temperature curing product. Some of these products
are also mildly heat accelerable.
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Lower viscosity materials offer better flow and less entrapped air bubbles.
Higher viscosity materials work well in parts that are not tightly sealed and
could leak or where underfill is not wanted. Higher viscosity products with
higher filler levels may also offer better thermal conductance and higher
strengths.
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A number of these products have UL or Mil Spec approvals.
Additional Information:
Gels Product Information
Elastomeric Encapsulants Product Information
Gels
Tutorial
Encapsulants Tutorial
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