Dow Corning Cookie Policy

We use cookies to enhance your experience with Dow Corning. Learn how cookies are used on this website and view our privacy statement.

By continuing to browse this site, you agree and consent for cookies to be used.

Continue
Silicones from Dow CorningWe help you invent the future.
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Search
Go
Products             Technical Library             Premier Services             About Dow Corning             Careers
Electronics Products
Electronics Solutions
Product Resources
Applications
Technical Resources

Encapsulants


1  1  2  3  4  5  6  7  8  9  10  >
Gel and Encapsulant Processing - GeneralGel and Encapsulant Processing - General

Dow Corning® brand addition cure gels and elastomers are solventless silicone materials designed for potting and encapsulating electronic components. They are available in heat-curing and room-temperature-curing versions, both clear and opaque. They are supplied in either one or two-part systems. The two-part 1 to 1 mix ratio products are supplied as Part A and Part B. The 10 to 1 mix ratio products are supplied as a base and curing agent.

Most Dow Corning silicone elastomers and gels have viscosities low enough to flow readily around intricate parts. When properly cured, they form resilient coatings that provide protection from moisture, dirt, shock, vibration and other harsh environmental factors. All are resistant to radiation and high temperature. In addition, several elastomers have been certified to the UL 94 Flammability classification.

Dow Corning provides a broad line of gels and elastomers offering a choice of physical properties. The product line features materials with varying hardness, cure time, viscosity and primerless adhesion. These broad feature offerings allow you to choose the correct material for your application. You can connect to our interactive Product Finder for Gels or Encapsulants here.

 

1  1  2  3  4  5  6  7  8  9  10  >

< back to Encapsulants Home Page  
 
Module with gel potting

  1. Gel and Encapsulant Processing - General


  2. Gel and Encapsulant Processing - General


  3. You Don't Have To Do It Alone!


  4. Substrate Preparation


  5. Material Preparation


  6. Applying Gel or Encapsulant


  7. Curing


  8. Cure Inhibition


  9. Where Does Inhibition Occur


  10. Repairing Gels or Encapsulants


  11. Tell Us What You Need


Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2014 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.