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Substrate Preparation

For best results, units to be encapsulated or potted should be clean of grease, oil and other surface contaminants. For gels and elastomers without primerless adhesion, optimum adhesion is obtained with the use of a primer.  Gels typically rely on mechanical adhesion gained through their sticky nature, but several are available with primerless chemical adhesion.

Common cleaners for substrate preparation include Dow Corning’s line of OS Fluids, isopropyl alcohol, toluene and acetone. In most instances a quick wipe of the surface is adequate to clean the module for potting.

Prior to potting, substrates should be kept in a clean area and protected from accumulating potential contaminants such as dirt and dust.

If a primer is necessary, the Primer should be applied in a very thin coat to clean, dry surfaces. For more information on selecting the right Dow Corning Primer for your substrate and material and for application guidelines, please refer to the Primers Product Family.

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  1. Gel and Encapsulant Processing - General

  2. Gel and Encapsulant Processing - General

  3. Substrate Preparation

  4. Material Preparation

  5. Applying Gel or Encapsulant

  6. Curing

  7. Cure Inhibition

  8. Where Does Inhibition Occur

  9. Repairing Gels or Encapsulants

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