Optical Encapsulants

Dow Corning® brand silicone LED (light emitting diode) encapsulants are designed to meet the challenging needs of the LED market, providing high adhesion, high purity, moisture resistance, thermal stability and optical transmittance for next generation devices. Silicone materials can absorb stresses caused by thermal cycling inside the package, protecting the chip and the bonding wires. And with the electronics industry quickly moving toward lead-free processing, silicone encapsulants, with their demonstrated, excellent stability at reflow temperatures, are a natural fit for LED applications.

Silicone Encapsulants
Two different types of silicone are commonly used as LED encapsulants: Methyl based and Phenyl based silicones. These encapsulants can be tailored to meet the needs for a variety of LED device architectures and help in maximizing both device performance and value. As an example, the patented Phenyl based encapsulant offerings from Dow Corning can result in higher light output and improved lumen maintenance in widely used LED devices, avoiding the fast degradation of lumen commonly experienced with other materials. When coupled with the improved barrier properties of these encapsulants, the selection of Dow Corning Phenyl based encapsulants can result in improved reliability, improved performance and improved overall total cost of ownership.

Encapsulant Product Lines