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| Excellent thermal stability (as low as -45 to >260ºC) | | Enables packages to pass common industry reliability and
lead-free reflow temperatures | |
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| Very low moisture uptake | | Packages can be designed to conform to industry reliability
standards | |
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| Variable modulus (typically less than 1 MPa) | | Design flexibility to absorb stress within the package | |
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| Excellent adhesion to a wide variety of materials | | Improved device reliability because of delamination
resistance | |
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| Low ionic content (typically ionic levels <1 ppm) | | Minimized corrosion potential | |
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| Excellent optical properties (high light transmittance) | | Well-suited for near IR, visible, or UV wavelength
applications | |
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| Dispensed or molded by a variety of techniques | | Efficient automated assembly process | |
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| Wide range of viscosities available | | Reliable dispense and molding processes | |
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