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Silicon Lithography


E-beam Resists


DOW CORNING® XR-1541 E-beam Resists (PDF: 26 KB) are hydrogen silsesquioxane resin solutions specifically formulated for research groups to directly write the finest patterns.

They are negative acting resists available for spin coating to a range of thin film thicknesses from 30 to 180 nm. Customized concentrations are also available for thinner or thicker resists.

Performance Properties:

  • E-beam patternable
  • High resolution
  • Etch resistance
  • Thin films

Physical Form: Liquid solution of silicon resin in carrier solvent

Resin: Hydrogen silsesquioxane resin

Application Use: E-beam negative resist

 

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