Thermal Interface - Pads and Films

Long-term, reliable protection of sensitive circuits

Dow Corning's family of Thermal Interface Pads & Films provides excellent thermal management options without having to deal with liquid material handling and curing. Thermal Interface Pads & Films offer superior performance in a wide range of applications while providing excellent economic value. Long-term, reliable protection of sensitive circuits and components is important in many of today's delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more compact electronic modules, the need for thermal management is growing.

Thermal Sell Sheets Kit Sell sheets Thermal Gap Pad Metrics Conversions (PDF size= 802 KB) Presentation: Thermal Management & How to Find the Right Gap Pad (PDF size = 399 KB) Cured samples Dow Corning Electronics Converter Network Dow Corning offers Thin Thermal Interface and Gap Filler Thermal Interface materials for use on irregular surfaces.

TP-1500 series Thin Thermal Interface Materials Part Numbers

TP-2100 series Gap Filler Thermal Interface Materials Part Numbers

Dow Corning also offers a complete line of Thermal Interface - Wet Dispensed and cured materials.  These include:

• Thermally Conductive Adhesives
• Encapsulants
• Gels
• Greases

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Thermal White Papers

• Soft Pad Opportunities
• Easy Rework with Dow Corning Thermal Compounds
• Understanding Thermal Performance Data
• Understanding non-thermal property impact on thermal performance
• Understanding Differences Between Thermal Interface Materials
• Silicone Grease Solutions For Your Thermal Interface Needs
• Discussion on Silicone Thermal Interface Materials - Questions and Answers

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