Thermal Interface - Pads and Films

Gap Filler Thermal Interface Materials Overview

(Formerly known as Heat Path™)

Potential Uses
Thermal bridge for low thermal resistance between heat sources and heat sinks of power components

Application Method
Cold applied requiring no heating or curing, material can be installed and removed easily and cleanly

	Dow Corning® Brand Product		Description		Features
	TP-2100 Thermal Pad		Gap filler interface Foam based thermal gel		Gap filling, foam based thermal bridge; high compressibility, soft, tacky, conformable, UL 94 HB
	TP-2101 Thermal Pad		Gap filler interface Foam based flame retardant thermal gel		Flame retardant, gap filling, foam based thermal bridge; high compressibility, soft, tacky, conformable, UL 94 V-1
	TP-2160 Thermal Pad		Gap filler interface Foam based one side tacky thermal gel		One side tacky, gap filling, foam based thermal bridge; high compressibility, soft, tacky, conformable, UL 94 HB

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Technical Data  

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