With increased miniaturization of systems and greater circuit density,
today’s electronics generate large amounts of heat. If the heat is not carried
off and dissipated, the operational lifetime and reliability of the electronics
can be reduced. This is a problem that needs to be addressed for everything
from individual devices to electronic modules and systems.
Dow Corning supplies many types of thermal interface materials such as
fabricated films and pads, which do not need to be dispensed or cured. These
include thin thermal pads, gap fillers and phase change films. Fabricated films
and pads are supplied ready to use for those who prefer not to utilize curing
processes. These materials are cold-applied with no need for special tools and
equipment. They can be supplied in roll form and in pre-stamped shapes specific
to your application. They are easily removed and reworked when
needed.
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If you need a
material:
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Consider
products:
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For highly demanding requirements of heat dissipation
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With high levels of thermal conductivity
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With lowest values of thermal resistance
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Designated as “thin thermal interface” or “phase change” materials
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To be used on irregular surfaces
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Designated as “gap filler” materials
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That requires very low mounting force
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Designated as “phase change” materials
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With higher strength
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Reinforced with stronger matrix materials such as fiberglass
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To be used in stress-sensitive applications
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With low durometer values
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With easier handling
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That are sticky only on one side
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