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Patternable Silicones for Electronics


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Dow Corning(R)WL-5000 series Photopatternable Spin-On Silicones are designed to provide low-stress, low-temperature-curable transparent patterned films for a variety of micro- and optoelectronics applications.

You can download a free reprint (510 Kb pdf file) of the article "A New Approach to Wafer-Level Packaging Employs Spin-On and Printable Silicones" from the July issue of Chip Scale Review by clicking on the image at the right.

And you can view the recording of our recent Photopatternable on-line seminar to learn more about Photopatternable silicones, their benefits and potential uses, key integration steps for device builds, building prototype packages, and much more.  

PDF Links will download files in Adobe Acrobat PDF format. For technical information, or to download the free Acrobat Reader, go to Acrobat help

Chip Scale Review Reprint

Link to the Photopatternable Silicone Materials Overview
Type: Silicone Film
Physical Form: Clear Solution
Special Properties: Low-stress; low-temperature curable negative tone photo-patternable thick film with high thermal stability; low shrinkage; good moisture resistance; high transparency and patternable to an aspect ratio less than 1.3 with sloping sidewalls; demonstrated integration processes; easily reworkable
Potential Uses: Front and backside wafer protective layer; stress-buffer layer applications; redistribution layer; soldermask; negative photoresist; adhesive layer; sacrificial layer
Technical DataTutorial

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