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Precured Gel - Pads and Parts


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Differences for Stamp-and-Place Processes

Processing is very similar for stamp-and-place processing.  However, after the next gel pad has been indexed into position in Step 1, it must be cut to shape.  To do this, the head must be more complex with provisions for stamping the desired shape from the strip material.  This can be accomplished by including the desired shape of steel rule die around the circumference of the head.  The pick-up head is recessed in the steel rule by a distance equal to the thickness of the sealant pad.  So, the head assembly first comes down and stamps the next available pad, then picks up the stamped grommet as before.  During the insertion process, the concave head extends out from within the steel rule.  The head retracts as it moves to stamp and pick the next grommet.  

Pad drawing

Also, since there is residual gel pad material remaining on the edge of the Mylar ® carrier, the nip rolls mentioned for pick-and-place processes cannot be used since they would not remain clean.  Here, after stamping and removing the grommet, the roll is indexed to its next position by two pairs of pins with each pair of pins attached to a block.  One block acts as an anchor and moves down to pin the carrier in place.  In the up position, the carrier is able to move.  The other block of pins now moves down and then horizontally between two stops to index the carrier to its next position.

Carrier with pad removed

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< back to Precured Gel - Pads and Parts Home Page  
 
  1. Connector Design Guidelines and Processing


  2. Equipment Alliance Capability


  3. Creating an Effective Seal with Dow Corning® Connector Sealant Pads


  4. Considerations for Connector Design


  5. Further Considerations for Connector Design


  6. Packaging, Storage and Handling


  7. Application Methods


  8. Differences for Stamp-and-Place Processes


  9. How Can Dow Corning Help You?


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