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Precured Gel - Pads and Parts


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Differences for Stamp-and-Place and Score-and-Place Processes

Processing is very similar for stamp-and-place processing.  However, after the next gel strip has been indexed into position in Step 1, it must be cut to shape.  To do this, the head must be more complex with provisions for stamping the desired shape from the strip material.  This can be accomplished by including the desired shape of steel rule die around the circumference of the head.  The pick-up head is recessed in the steel rule by a distance equal to the thickness of the sealant pad.  So, the head assembly first comes down and stamps the next available strip, then picks up the stamped grommet as before.  During the insertion process, the head extends out from within the steel rule.  The head retracts as it moves to stamp and pick the next grommet.  

Also, since there is residual gel material remaining on the edge of the Mylar ® carrier, the nip rolls mentioned for pick-and-place processes cannot be used since they would not remain clean.  Here, after stamping and removing the grommet, the roll is indexed to its next position by two pairs of pins with each pair of pins attached to a block.  One block acts as an anchor and moves down to pin the carrier in place.  In the up position, the carrier is able to move.  The other block of pins now moves down and then horizontally between two stops to index the carrier to its next position.  

Remainder at edges

A score-and-place process is a simpler version of the above, where the sealant strip simply needs to be scored in a straight line.  To do this, a straight length of steel rule on the head scores the product at the desired grommet length.  And in this process method, there is again no residual gel material remaining on the Mylar ® carrier and nip rolls can be used to advance the strip to the next position.

Slit roll

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  1. Connector Sealant Strips Processing


  2. Equipment Alliance Capability


  3. Creating an Effective Seal with Dow Corning ® Sealant Strips


  4. Packaging, Storage and Handling


  5. Application Methods


  6. Differences for Stamp-and-Place and Score-and-Place Processes


  7. Manual Applications


  8. How Can Dow Corning Help You?
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